Capability&proces:
Rigid pcb |
FILM |
MIN. LINE WIDTH : 0.5MIL
MAX. SIZE : 24＊36 |
MIN. 2MIL |
20﹪ |
MATERIAL |
MIN. THICKNESS : 0.1MM
MAX. THICKNESS : 6.0MM |
BOARD THICKNESS＞0.3MM |
±0.05MM |
DIRLLING |
MIN. HOLE SIZE : 0.15MM
MIN. SLOT HOLE SIZE : 0.65MM |
HOLE SIZE : 0.4MM |
±0.05MM |
PTH |
MAX. ASPECT RATIO : 1: 8 |
|
|
DRY FILM |
MIN.LINE WIDTH : 4MIL MIN.SPACING : 4MIL |
LINE WIDTH : 4MIL SPACING : 4MIL |
15﹪ |
PLATING
（H/H）OZ
（1/1）OZ
（2/2）OZ |
MIN.LINE WIDTH : 4MIL MIN.SPACING : 4MIL
MIN.LINE WIDTH : 6MIL MIN.SPACING : 6MIL
MIN.LINE WIDTH : 8MIL MIN.SPACING : 8MIL
|
LINE WIDTH : 8MIL
SPACING : 5MIL(H/H) |
15﹪ |
SOLDMASK&SILK |
MIN.LINE WIDTH : 4MIL |
LINE WIDTH : 6MIL |
15﹪ |
CNC ROUTING |
CNC SIZE TOLERANCES : ±0.1MM
MIN.SLOT HOLE SIZE : 0.8MM
V-CUT SIZE TOLERANCES : ±0.15MM |
SLOT HOLE SIZE
: 1.2MM |
±0.05㎜ |
TEST O/S |
FLY PROBE : MAX.SIZE 500MM＊600MM |
|
|
|
DENSITY : 1MIL |
|
99﹪ |
|
FIXTURE : MAX.SIZE 400MM＊800MM
DENSITY : 4MIL |
|
|
UNIVERSAL : MAX.SIZE 300MM＊400MM |
|
|
DENSITY : 3MIL |
|
|
VOLTAGE : LOW 5V HIGH 220V CURRENT : 100MA |
|
|
INSULATION : 5MΩ RESISTANCE : 50Ω |
|
DOUBLE SIDE |
MIN. THICKNESS : 0.2MM |
0.4MM |
|
FOUR LAYER |
MIN. THICKNESS : 0.25MM |
0.6MM |
|
SIX LAYER |
MIN. THICKNESS : 0.6MM |
0.8MM |
|
＊1、LEAKAGE:2*2m/m2 PAD SPACING 4MIL VOLTAGE 60V，LEAKAGE MAXIMUM １μA，MATERIAL FR4
＊2、TOW HOLE SPACING MINIMUM 0.1㎜，OPTIMIZE SIZE 0.2㎜
........................................................................................................
Flexible PCB |
PROCESS |
TECHNICAL CAPABILITY |
OPTIMIZE SIZE |
TOLERANCES |
MATERIAL |
MIN. BOARD THICHNSS
SINGLE SIDE：0.065MM（( CACULATED THE BIGGEST BOARD THICKNESS BY LINE WIDTH&SPACING 4/4MIL
(INCLUDE SINGLE SIDE COPPER FOIL )）
DOUBLE SIDE：0.12MM（( CACULATED THE BIGGEST BOARD THICKNESS BY LINE WIDTH&SPACING 4/4MIL (INCLUDE DOUBLE SIDE COPPER FOIL )）
SINGLE SIDE：0.22MM（（CACULATED THE BIGGEST BOARD THICKNESS BY LINE WIDTH&SPACING 8/8MIL
(INCLUDE SINGLE SIDE COPPER FOIL )）
DOUBLE SIDE：0.32MM ( ( CACULATED THE BIGGEST BOARD THICKNESS BY LINE WIDTH&SPACING 8/8MIL (INCLUDE DOUBLE SIDE COPPER FOIL ))
|
|
+0.05MM
-0.05MM
+-0.05MM |
DRILLING |
MIN. HOLE SIZE：0.2MM |
HOLE SIZE : 0.4MM |
+-0.05MM |
PTH |
MIN. HOLE SIZE：0.2MM |
HOLE SIZE : 0.4MM |
+-0.05MM |
DRY FILM |
MIN. LINE WIDTH：4MIL
MIN. SPACING：4MIL |
LINE WIDTH：6MIL
SPACING：6MIL |
15% |
COVERLAY |
MIN. PAD： 0.6MM |
PAD：0.8MM |
COLOR=BROWN |
SOLDMASK&SILK |
MIN. LINE WIDTH：4MIL |
LINE WIDTH：6MIL |
15% |
CNC ROUTING |
MIN. STEEL RULE DIE/SRD：3MM*3MM
MIN. HARD DIE：0.8MM*2MM |
HARD DIE：3MM |
+-0.1MM
+-0.05MM |
TEST O/S |
FLY PROSE：SIZE 25MM*30MM |
|
99% |
|
DENSITY：1MIL |
|
|
FIXTURE：SIZE 400*600MM |
|
|
DENSITY：4MIL |
|
＊MIN. BOARD THICKNESS、LINE WIDTH、SPACING ARE WITHIN NO RANGE-LIMITED COPPER FOIL THICKNESS.（USED BY MIN. COPPER THICKNESS）。
...................................................................................................
Control Item |
Incoming Inspection |
- Outlook
- Copper thickness
- Board thickness
- Heat durability, peel strength, water absorption
- , Tg value, CTE-Z axis, Dk, Df, Rv, Rs
|
Drill |
- Drill Data (version check)
- Drill Bit (Sequence & Spec.)
- Stack No. Control
- Hole Count Check
|
DE-SMEAR、 PTH、Pattern Plating |
- Concentration of Liquid
- Hole Wall (per customer spec.)
- Micro-section(Inner layer bonding, coverage, void)
- Belt Sanding
|
Dry Film O/L Image Transfer |
- Trace width/space (±20%)
- D/F lamination condition(Temp., Pressure, Speed
- , Wrinkle, Film on PIN hole)
- Develop(Temp., Pressure, Speed, Concentration)
- Exposure(Vacuum pressure, Power)
- Clean Room Control
|
Pattern Plating |
- Cu thickness Surface/Hole (per customer spec.
- or IPC spec.)
- Plating Bath(Bath concentration, Temp., Time,
- Current, Bath Replacement Timing)
- Film Strip(Concentration, Temp., Pressure,
- Replenish Time)
- Etch(Concentration, Temp., Pressure, Replenish
- Time, .Calibration of Specific Gravity Meter)
- Tin Strip(Speed, Pressure, Replenish Time)
- Cleanness of Tin Stripping
|
Solder Mask |
- Ink (Color, Model No., per Engineer Spec.)
- Engineer Spec.(Plugging, Coating thickness)
- Develop(Bath replacement frequency, water
- absorb wheel cleansing, PH value calibration of
- auto-dose system, rinse tanks cleansing)
- Exposure(Power, registration, stain)
|
Finish (Gold Plating, ENIG, HASL, G/F) |
- Au/Ni thickness
- Tin/lead thickness-50u”~300u”
- Scratch, pinhole, dent, skip/missing plating, under
- plating, whitening, water stain Oxide, hole plugged,
- insufficient hole size, tin whiskers caused shortage,
- tin/lead on gold finger, S/M scratch
- peel strength test(3M 600# tape test)
-
|
Legend |
- Ink (Color, Model No.)
- Baking condition
- UV m/c
|
Routing |
Peel strength test(3M 600# tape test)
- Tolerance ±5mil or per customer spec.
- Routing program and size check
- Tooling change(follow tooling life guideline)
|
E-Test |
- self fixture test
- Current, Voltage
- G/NG separation
- Test mark/stamp or customer requirement mark
- Test program
|
FQC |
- Appearance check
- Hole inspection
- Bow/Warp inspection (< 0.7%)
|
OQC |
- Contour dimension, V-cut depth, bevel angle
- Hole size measure
- Board thickness and P.P stackup confirm
- Hole wall/surface Cu thickness measure
- Reliability Test (thermal shock)
- Customer’s special requirement check
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